Ukucutshungulwa kwerabha yeSilicone kwiShishini lee-elektroniki

By UMike Chen, Umlawuli weMveliso | Iminyaka eli-12+ kwiMveliso yeRabha |I-LinkedIn

Izinto ezibalulekileyo ekufuneka ziqwalaselwe

• Irabha yesilicone esetyenziswa kwi-elektroniki ifuna ukunyamezelana kokucubungula ngaphakathi kwe-±0.1 mm kwi-gaskets kunye ne-seals kunye nokuthobela i-UL 94 V-0 flame retardant kwizixhobo ze-elektroniki zangaphakathi.
• Oomatshini bokusika i-silicone echanekileyo abanolawulo lwe-servo motor bafumana ukuchaneka kokutya kwe-±0.1 mm ngesantya sokusika ukuya kuthi ga kwiimela ezili-120 ngomzuzu ukuze kwenziwe iinxalenye ze-elektroniki.
• Amandla okukrazula aphantsi eSilicone enza ukuba ukukrazula ngoomatshini kube nzima; ukukrazula nge-cryogenic ukusuka kwi -100°C ukuya kwi -130°C yindlela ekhethwayo kwizixhobo ze-elektroniki ze-silicone ezine-flash encinci engaphantsi kwe-0.3 mm.
• Iinkqubo zokucoca nezokomisa ezithatha izigaba ezintathu zisusa izinto ezikhupha isikhunta kunye nongcoliseko lwamaqhekeza ngaphambi kokuba izixhobo ze-elektroniki ze-silicone ziqhubeke nokuhlanganiswa okanye ukupakisha.

Impendulo emfutshane:Ukulungiswa kwerabha yesilicone kushishino lwe-elektroniki kubandakanya ukunqunyulwa ngokuchanekileyo kwamaphepha esilicone abe zii-gaskets kunye nezitywini, ukukhupha izinto ze-silicone ezibunjiweyo kwi-elektroniki, ukucoca ukususa izinto ezikhupha isikhunta kunye nongcoliseko lwamaqhekeza, kunye nokulungiswa okulawulwayo ukuze kufezekiswe iipropati ezithile zomzimba. Ngenxa yokuba iindawo ezibiyelweyo ze-elektroniki kunye nezinto ezitywinayo zifuna ukunyamezelana okulinganayo ngaphakathi kwe-±0.1 mm kunye nokucoceka komphezulu ofanelekileyo kwiindawo zokucoca, izixhobo zokucubungula ezizenzekelayo ezinolawulo lwe-servo motor, ucwangciso lwe-PLC, kunye neenkqubo zokucoca ezinamanqanaba amaninzi ziqhelekile kwimveliso yesilicone ye-elektroniki.

Irabha yesilicone ichazwe kwi-elektroniki ngenxa yokuzinza kwayo kubushushu, iimpawu zokufakelwa kombane, kunye nokumelana nokonakaliswa kwendalo. Izicelo eziphambili ziquka ii-keypad membranes, izitywino ze-connector, ii-EMI gaskets, ii-display bezel gaskets, izitywino ze-battery compartment, kunye neebhutsi zokukhusela zeswitshi kunye nee-sensors. Isicelo ngasinye sibeka iimfuno ezithile zokucubungula ezahlukileyo kwi-silicone molding yenjongo eqhelekileyo ngenxa yokunyamezelana okuqinileyo kunye nemigangatho yococeko efunekayo yi-electronic assembly.

Ngenxa yokuba irabha ye-silicone inobushushu bokutshintsha kweglasi obukufutshane ne--120°C kwaye inamandla okukrazula aphantsi xa ithelekiswa nezinye ii-elastomers, ukucubungula kwayo kufuna izixhobo kunye neeparameters ezilungiselelwe ezi mpawu zomzimba. Eli nqaku ligubungela amanqanaba aphambili okucubungula - ukusika, ukucoca, ukucoca, kunye nokuqinisekiswa komgangatho - kwizixhobo zerabha ye-silicone ezisetyenziswa kwiimveliso ze-elektroniki.

Izicelo zeRubber yeSilicone kwi-Electronics: Iimfuno zokuSebenza

Izixhobo zerabha zesilicone kwiimveliso ze-elektroniki zahlulwe zibe ziindidi ezintathu ngobunzima bokucubungula. Iigasket kunye nezitywino zihlala zisikwa okanye zisikwe kwiishiti zesilicone ezilungisiweyo ezinobukhulu obuqala kwi-0.5 mm ukuya kwi-5.0 mm.I-ASTM D2000Ukuhlelwa kweemveliso zerabha, ii-silicone gaskets ze-elektroniki zihlala zichazwe phantsi kwemigca efana ne-2GE705 kunye neemfuno zobunzima, ukuxinana, kunye nobude obuthile kwisicelo.

Izinto ze-silicone ezibunjiweyo — iikeypad, iibhutsi, kunye nezivalo ezenziwe ngokwezifiso — ziveliswa ngokucinezela okanye ngokufaka i-liquid silicone rubber (LSR) injection molding. Ezi ndawo zifuna ukususwa kwe-flash emva kokubumba, kwaye i-flash encinci eqhelekileyo yokubumba i-LSR ifuna i-cryogenic okanye i-precision mechanical deflashing. Udidi lwesithathu, ii-silicone encapsulants kunye nee-potting compounds, zisetyenziswa njengolwelo kwaye zinyangwe endaweni ngaphandle kokucutshungulwa koomatshini.

I-UL 94 kunye ne-IEC 60068 zibhekiselwe kwiimfuno zovavanyo lokurhoxiswa komlilo kunye nokusingqongileyo kwizicelo ze-elektroniki.

Ukusikwa kweSilicone echanekileyo kwiinxalenye ze-elektroniki

Iumatshini wokusika we-siliconeI-Xingchangjia evela kwiXiamen yenzelwe ukucubungula amaphepha e-silicone kunye nokuqengqeleka kwiimilinganiselo ezichanekileyo ezifunekayo kwii-gaskets ze-elektroniki kunye nezitywini. I-servo motor drive yomatshini kunye nolawulo lwesikrini sokuchukumisa se-PLC kuvumela iipateni zokusika ezinokucwangciswa ngobunzulu obuhlengahlengiswayo kunye nokukhetha iibhleyidi, ukuphatha amaphepha e-silicone, iityhubhu, kunye neemilo ezenziwe ngokwezifiso.

Ukuze kwenziwe ubuninzi obukhulu beenxalenye ze-silicone ze-elektroniki,umatshini wokusika we-silicone ozenzekelayo ngokupheleleyoInika ukusebenza okuqhubekayo ngokufaka izinto ngokuzenzekelayo. Iinkcukacha eziphambili ziquka ububanzi bokusika obuhlengahlengiswayo ukusuka ku-zero ukuya phezulu, ubude beblade obuyi-550 mm, ubukhulu bokusika obuvela kwi-0 ukuya kwi-10 mm, kunye nesantya sokusika esifikelela kwiimela ezili-120 ngomzuzu. Umatshini usebenzisa isilinda somoya ukucinezela izinto ngoxinzelelo oluhlengahlengiswa ngokuzenzekelayo kubukhulu bezinto, ukuphelisa ukulungiswa kwentwasahlobo ngesandla okufumaneka kwizixhobo ezindala. Inkqubo elawulwa yi-PLC ijonga ukutya kwezinto, ukubalwa kwemveliso, kunye nokufaka izinto ngee-alamu ukuze kujongwe ukunqongophala kwezinto kunye neemeko zokugcwala kwazo.

Ukuqabula ngokuqabula — ukunqumla umaleko we-silicone kodwa kungekhona i-release liner — yindlela eqhelekileyo yee-gaskets ze-silicone ezisekelwe kwi-adhesive ezisetyenziswa kwiindawo zokuvala ze-elektroniki. Ukuchaneka kokufunxa kwe-servo motor ye-±0.1 mm kubalulekile ekugcineni ukuhambelana okulinganayo kumawaka eendawo ngebhetshi nganye.

Izixhobo ze-elektroniki zeRabha yeSilicone ekhupha ulwelo

Iimpawu zomzimba zeSilicone zenza imingeni ekhethekileyo yokukhuhla i-flashing. Ngenxa yokuba irabha yesilicone inamandla okukrazula aphantsi kunye nokuguquguquka okuphezulu, i-mold flash ebhityileyo iyaguquguquka endaweni yokuqhekeka phantsi kokukrazulwa koomatshini. Kwizinto ze-elektroniki zesilicone ezinobukhulu be-flash obungaphantsi kwe-0.3 mm, ukukhuhla i-mechanical kuyingozi yokukrazula izinto ezisisiseko kwindawo yokudibana kwe-flash. Ukukhuhla i-cryogenic kwi--100°C ukuya kwi--130°C kusetyenziswa i-nitrogen engamanzi kukhetha ukukhuhla i-flash encinci ngelixa kugcinwa ukuqina kwesakhiwo somzimba wesilicone, okuvumela ukususwa kwe-flash ecocekileyo ngaphandle komonakalo womphezulu.

Kwiindawo ze-silicone ezine-flash etyebileyo engaphezulu kwe-0.3 mm okanye iijometri ezilula zomgca wokuhlukana, i-mechanical deflashing ingasetyenziswa nge-soft media kunye nesantya esinciphileyo sokuwa.Umatshini wokucoca ngoomatshini we-XCJ-G600Icubungula iindawo zesilicone ngaphakathi kobubanzi bayo obuyi-3 mm ukuya kwi-100 mm xa ilungiswa ngeeparameter ezifanelekileyo, nangona iibhetshi zovavanyo zicetyiswa ukuqinisekisa umgangatho womphezulu ngaphambi kokuba ivelise ngokupheleleyo.

Ukucoca kunye nokomisa iinxalenye zeSilicone zokuhlanganisa nge-elektroniki

Izixhobo ze-elektroniki ze-silicone zifuna ukucocwa emva kokubumba nokukhuhla ukuze kususwe izinto ezikhupha isikhunta, uthuli olushiyekileyo lwe-flash, kunye nokuphatha izinto ezingcolisayo. Izinto ezikhupha isikhunta zinokuphazamisana nokunamathela okunamathelayo ngexesha lokuhlanganiswa kwe-elektroniki, kwaye ungcoliseko lwe-conductive particulate lunokubangela ii-short circuits kwizixhobo ezidibeneyo.umatshini wokucoca nowomisa irabhaYenzelwe ngokukodwa irabha ye-silicone, izixhobo zekhompyutha, iiplastiki, kunye neendawo zokuvala ze-elektroniki, kusetyenziswa amaqela amathathu eenkqubo zokucoca ezinamanqanaba amathandathu ezinokudityaniswa ngokukhululekileyo kumanqanaba ahlukeneyo ongcoliseko.

Kwizicelo ze-elektroniki ezifuna ukuhambelana negumbi lokucoca, inkqubo yokucoca kufuneka isebenzise amanzi angena-ion kunye ne-non-ionic surfactants ilandelwe kukomiswa okuhluziweyo yi-HEPA ukuthintela ukungcoliswa. Amanqanaba amathandathu okucoca komatshini avumela imijikelo yokuhlamba, ukuhlamba, kunye nokomisa elandelelanayo enokuhlelwa kwiifomyula ezithile ze-silicone.IPC-1601imigangatho yokuphatha iindibano ze-elektroniki, ukuqinisekiswa kococeko kufuneka kuquke ukuhlolwa ngokubonakalayo kwi-10x yokukhulisa kunye novavanyo lokungcola kwe-ionic kwiindawo ezingena kwiindibano ze-elektroniki ezithembeke kakhulu.

Ulawulo loMgangatho kwiNkqubo yeRubber yeSilicone kwi-Electronics

Iiparameter zomgangatho zisekelwe kwiinkcukacha eziqhelekileyo zezinto zerabha ze-silicone kwiimveliso ze-elektroniki zabathengi kunye nezemizi-mveliso. Iimfuno ezithile ziyahluka ngokwe-OEM.

Ukuhlolwa kobukhulu beendawo ze-elektroniki ze-silicone kufanele kuthathelwe ingqalelo i-coefficient yokwandiswa kobushushu bezinto, emalunga namaxesha ama-3-4 aphezulu kune-NBR okanye i-EPDM. Iindawo ezilinganiswe kuma-25°C zingafikelela kwi-0.15% ezinkulu kunezo ziqhelekileyo zobushushu obuqhelekileyo obuyi-23°C obuchazwe kwi-ISO 3601 yokulinganisa ubukhulu be-O-ring. Iindawo zokuhlola ezilawulwa bubushushu ziyacetyiswa kwiinxalenye ze-elektroniki ze-silicone ezichanekileyo.

Isiphelo: Ukucutshungulwa Okudibeneyo Kwerabha Yesilicone Yebanga Le-Electronics

Ukulungiswa kwerabha yesilicone kushishino lwe-elektroniki kufuna ukuchaneka kwinqanaba ngalinye — ukusuka ekusikeni nasekukhupheni inkunkuma ukuya ekucoceni nasekuqinisekiseni umgangatho. Amandla aphantsi okukrazula kunye nobushushu obuphezulu beeparameter zezixhobo ze-silicone ezifunekayo ezahlukileyo kwezo zisetyenziselwa iikhompawundi ze-NBR, EPDM, okanye ze-FKM. Oomatshini bokusika abazenzekelayo abanolawulo lwe-servo motor, i-cryogenic deflashing kwiindawo ze-silicone ezi-thin-flash, kunye neenkqubo zokucoca ezinamanqanaba amaninzi zenza umgca oqhelekileyo wokucubungula izinto ze-silicone ezikumgangatho we-elektroniki.

Abavelisi abangena kwimarike ye-silicone ye-elektroniki kufuneka baqinisekise inqanaba ngalinye lokucubungula ngeebhetshi zovavanyo ngaphambi kokuba kwenziwe ngokupheleleyo, benika ingqalelo ekhethekileyo ekukhetheni indlela yokucoca ngokusekwe kubukhulu befleshi kunye nokusebenza kakuhle kokucoca ukususa isikhunta.